Cooling the AI Era with high-density data center solutions. From rear-door heat exchangers to Direct Liquid Cooling (DLC) with intelligent CDUs, B.A.T delivers the thermal performance and operational excellence that AI-dense workloads demand.
Cooling for the AI Era
AI and high-performance computing are pushing rack densities far beyond what traditional air cooling can handle. Today's GPU racks routinely draw 50–130 kW and more. B.A.T designs, integrates and services the liquid-ready thermal infrastructure that keeps high-density AI clusters cool, efficient and reliable.
Rear-Door Heat Exchangers (RDHx)
A liquid-cooled heat exchanger replaces the rack's rear door and removes heat right at the source, capturing up to roughly 60 kW per rack. RDHx lets you densify existing data halls without a full mechanical retrofit, eliminating hot-air recirculation and reducing reliance on room-level CRAC/CRAH cooling.
Direct Liquid Cooling (DLC)
Cold plates mounted directly on GPUs and CPUs carry heat away through a closed liquid loop, the most effective way to cool the densest AI accelerators. DLC dramatically improves thermal headroom, supports higher sustained performance, and cuts fan energy and overall PUE.
Coolant Distribution Units (CDU)
Our CDUs isolate the technology cooling loop from the facility water loop and precisely manage flow, temperature and pressure. With integrated monitoring, filtration and redundancy, the CDU is the heart of a safe, stable and serviceable liquid-cooling deployment.
Why B.A.T
- End-to-end delivery: thermal modeling, CDU sizing, manifold and rack integration
- Liquid-ready retrofits for existing data halls
- Energy- and water-efficient designs, ready for heat reuse
- 24/7 service and support